RPC trigger electronics board assembly for CERN’s ATLAS muon system

Supply of the assembly of about 360 electronics boards for the Resistive Plate Chambers (RPC) trigger system of the Barrel Inner (BI) part of the Muon system

Buyer updated · Deadline information updated · Summary and analysis updated · Tender facts updated · Original notice updated · Deadline updated · Location updated · Source notice details updated · Source references updated · Notice update added

Supply of the assembly of about 360 electronics boards for the Resistive Plate Chambers (RPC) trigger system of the Barrel Inner (BI) part of the Muon system

Reference: DO-35331/EP/ATLAS Status: Announcement - 2026-08-05 Market Survey - NA Price Enquiry - 11/2026 Available action: To express an interest please send an e-mail to procurement.service@cern.ch Description: Supply of the assembly of about 360 electronics boards for the Resistive Plate Chambers (RPC) trigger system of the Barrel Inner (BI) part of the Muon system (03030200) CERN intends to place a contract for the supply of the assembly of about 360 electronics boards for the Resistive Plate Chambers (RPC) trigger system of the Barrel Inner (BI) part of the Muon system, including quality control, labelling and Factory Acceptance Tests. Only the assembly of electronic parts is required. CERN will provide the PCBs and the complex components such as FPGAs, Low Power Giga Bit Transceiver (lpGBT) and commercial components like integrated circuits and connectors. The 42 x 18 cm^2 DCT-BI PCB has 12 copper layers from 17.50 ?m to 45 ?m interleaved with the FR-4 halogen free dielectric. Full vias, blind vias and microvias are used. Trace widths and gaps can be as small as 0.079 mm. The assembly must follow specific conditions like (among others): Automated Optical Inspection (AOI), after pick and place, use solder paste chosen to minimise corrosion and other undesired long-term effects, FPGA soldering using defined AMD soldering guidelines, cleaning using defined procedures. The quality control of the solder paste, X-ray inspection on 10 cards from pre-series and 10 cards from the first production batch of the assembled DCT-BMBO (Data Collector & Transmitter boards for Barrel Middle and Barrel Outer RPCs) boards shall be performed. Labelling and Factory Acceptance Tests shall also be done. The supply is expected to be delivered by Q2 2027. Considering the financing of this project, at least 50% of the Supply must originate in Italy and possibly Greece (to be decided prior to dispatch). Type of Contract: Supply Cost Range: 200k - 400k CHF

Summary and analysis updated

Supply of the assembly of about 360 electronics boards for the Resistive Plate Chambers (RPC) trigger system of the Barrel Inner (BI) part of the Muon system

CERN intends to place a contract for the supply of the assembly of about 360 electronics boards for the Resistive Plate Chambers (RPC) trigger system of the Barrel Inner (BI) part of the Muon system, including quality control, labelling and Factory Acceptance Tests. Only the assembly of electronic parts is required. CERN will provide the PCBs and the complex components such as FPGAs, Low Power Giga Bit Transceiver (lpGBT) and commercial components like integrated circuits and connectors. The 42 x 18 cm^2 DCT-BI PCB has 12 copper layers from 17.50 ?m to 45 ?m interleaved with the FR-4 halogen free dielectric. Full vias, blind vias and microvias are used. Trace widths and gaps can be as small as 0.079 mm. The assembly must follow specific conditions like (among others): Automated Optical Inspection (AOI), after pick and place, use solder paste chosen to minimise corrosion and other undesired long-term effects, FPGA soldering using defined AMD soldering guidelines, cleaning using defined procedures. The quality control of the solder paste, X-ray inspection on 10 cards from pre-series and 10 cards from the first production batch of the assembled DCT-BMBO (Data Collector & Transmitter boards for Barrel Middle and Barrel Outer RPCs) boards shall be performed. Labelling and Factory Acceptance Tests shall also be done. The supply is expected to be delivered by Q2 2027. Considering the financing of this project, at least 50% of the Supply must originate in Italy and possibly Greece (to be decided prior to dispatch). Estimated cost range: 200k - 400k CHF Procedure stage: Announcement; next step (estimated): Price Enquiry 09/2026

Summary and analysis updated

Supply of the assembly of about 360 electronics boards for the Resistive Plate Chambers (RPC) trigger system of the Barrel Inner (BI) part of the Muon system

CERN intends to place a contract for the supply of the assembly of about 360 electronics boards for the Resistive Plate Chambers (RPC) trigger system of the Barrel Inner (BI) part of the Muon system, including quality control, labelling and Factory Acceptance Tests. Only the assembly of electronic parts is required. CERN will provide the PCBs and the complex components such as FPGAs, Low Power Giga Bit Transceiver (lpGBT) and commercial components like integrated circuits and connectors. The 42 x 18 cm^2 DCT-BI PCB has 12 copper layers from 17.50 ?m to 45 ?m interleaved with the FR-4 halogen free dielectric. Full vias, blind vias and microvias are used. Trace widths and gaps can be as small as 0.079 mm. The assembly must follow specific conditions like (among others): Automated Optical Inspection (AOI), after pick and place, use solder paste chosen to minimise corrosion and other undesired long-term effects, FPGA soldering using defined AMD soldering guidelines, cleaning using defined procedures. The quality control of the solder paste, X-ray inspection on 10 cards from pre-series and 10 cards from the first production batch of the assembled DCT-BMBO (Data Collector & Transmitter boards for Barrel Middle and Barrel Outer RPCs) boards shall be performed. Labelling and Factory Acceptance Tests shall also be done. The supply is expected to be delivered by Q2 2027. Considering the financing of this project, at least 50% of the Supply must originate in Italy and possibly Greece (to be decided prior to dispatch). Estimated cost range: 200k - 400k CHF Procedure stage: Announcement; next step (estimated): Price Enquiry 09/2026

Published

Supply of the assembly of about 360 electronics boards for the Resistive Plate Chambers (RPC) trigger system of the Barrel Inner (BI) part of the Muon system

CERN intends to place a contract for the supply of the assembly of about 360 electronics boards for the Resistive Plate Chambers (RPC) trigger system of the Barrel Inner (BI) part of the Muon system, including quality control, labelling and Factory Acceptance Tests. Only the assembly of electronic parts is required. CERN will provide the PCBs and the complex components such as FPGAs, Low Power Giga Bit Transceiver (lpGBT) and commercial components like integrated circuits and connectors. The 42 x 18 cm^2 DCT-BI PCB has 12 copper layers from 17.50 ?m to 45 ?m interleaved with the FR-4 halogen free dielectric. Full vias, blind vias and microvias are used. Trace widths and gaps can be as small as 0.079 mm. The assembly must follow specific conditions like (among others): Automated Optical Inspection (AOI), after pick and place, use solder paste chosen to minimise corrosion and other undesired long-term effects, FPGA soldering using defined AMD soldering guidelines, cleaning using defined procedures. The quality control of the solder paste, X-ray inspection on 10 cards from pre-series and 10 cards from the first production batch of the assembled DCT-BMBO (Data Collector & Transmitter boards for Barrel Middle and Barrel Outer RPCs) boards shall be performed. Labelling and Factory Acceptance Tests shall also be done. The supply is expected to be delivered by Q2 2027. Considering the financing of this project, at least 50% of the Supply must originate in Italy and possibly Greece (to be decided prior to dispatch). Estimated cost range: 200k - 400k CHF Procedure stage: Announcement; next step (estimated): Price Enquiry 09/2026